Hardware @lemmy.ml Alphane Moon @lemmy.ml 5 mo. ago

TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

www.anandtech.com TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

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Hardware @lemmy.ml Alphane Moon @lemmy.ml 5 mo. ago

TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

www.anandtech.com /show/21414/tsmcs-3d-stacked-soic-packaging-making-quick-progress-3um-pitch-in-2027