When you're done soldering, cover the soldering iron tip in solder, and store it covered in solder. This prevents it from oxidizing when you're not using it
One tip that isn't mentioned is DITCH THE CONICAL TIP, USE A CHISEL TIP.
Conical tips have terrible thermal contact, as they have both poor surface area in contact. Also the tip is further from the heating element, preventing it from heating faster.
Additionally that tiny point doesn't store any heat, it cools down significantly as soon as it touches anything. A broad chisel tip stores more heat and is far more appropriate for through hole joints like this.
conicals are good for the small smd parts though, when having a huge contact area and big thermal mass means completely desoldering the part and dragging it off the board when you pull away.
of course, those aren't the conicals on a $20 orange handle plug in iron...
If you have problems, you should probably add flux (make sure to extract fumes if soldering with flux for a while). Some say there is never enough flux.
Depends on brand. And my head always hurts after inhaling them for more than a minute without a fume extractor. (I just use a PC fan and some old who-knows-what HEPA-like filter discarded from ventilation equipment. For quick jobs, I hold my breath and/or move out of the way.)
What it looks like: You shat all over the board.
What it smells like: Nasty chemicals but only when hot.
What it does: it helps distribute heat, and causes the solder to be less viscuous and stick to metals readily.
What it feels like to start using it: Wow, it's like I just gained one year of soldering experience!
What it feels like to remove it from the board after soldering: Aargh... I swear, one more board and I go buy an ultrasonic cleaner. (Some brands are easier but I usually need to employ a spudger, brush, then alcohol annd Q-tip)
Note that some solder comes with a core that contains flux or some similar substance of that effect.
It removes the oxide layer from existing surfaces so the solder sticks and flows better
It increases surface tension of the liquid solder so you get a nice round shape and no whiskers and less bridges
It helps distribute the heat a bit. It works a little bit like thermal paste, especially when the contact area between the tip and the pad/component is very small.
Generally, flux is your friend and soldering without flux is terrible.
touch the tip of the solder where the iron meets the pad or the pin
try to get as much contact with both the pad as the pin as you can
the pad could be dirty or not hot enough. Especially when the pad is connected to a ground or power plane layer in the PCB it may take longer than expected to reach a sufficient temperature. Usually adding some flux helps remove any dirt.
Both, which is why conical tips suck. They make poor contact with the pin and pad. With a chisel tip you make good contact with the pin and pad
You add some solder to the tip, then drag it across the pin and pad. Solder flows towards heat and if the joint is properly heated the solder should flow beautifully.
Sometimes the pad isn't heated (probably because the conical tip isn't heating it) and doesn't want to stick to the pad. It can also be due to oxidation on the joint surface. Add some flux to the surface and try again, allowing the iron to melt and activate the flux.
1 if all parts are hot, it shouldn't matter. As soon as you touch anything with the solder, it should distribute evenly around the pad and component.
2 you just feed it into the joint
If you are not quick enough, the flux in the solder evaporates and it becomes sticky. At this point, clean it and start fresh. Other possibility is that you didn't heat part and component enough for the solder to flow
Massive Ground planes on a multi layer board were my breaking point.
I tried to clean the through holes where a micro USB port was secured and only could get it cleared by drilling out the solder.... (Only had a soldering iron and wick available)
I've done the rgb mod for an old NES. The PPU is on a big ground plane and just impossible to get off using a wick. Or you can, but now you've put so much heat into the chip that you fried it. Need a heat gun or hot plate.
Playstation SD card mod is easier than hand desoldering the NES PPU, and it involves scraping away very thin traces and soldering to them.
Utilize Flux and alcohol. Clean with alcohol utilizing a wipe-clean-wipe method. After soldering with Flux, clean off residual Flux with alcohol. Leaving Flux can promote corrosion. My phone keeps autocorrecting Flux to capitalize it, and I don't care enough to fix it. 🤷♂️
Edit: Do not use clinical isopropyl alcohol solutions (~70% whatever). Those solutions need some water to work as a disinfectant. You want as little water as possible (>99% solution).
Believe it or not, isopropyl alcohol leaves residue behind. If you've ever wiped a shiny metal surface with it, you might see it looks a bit duller. Wiping after using alcohol is attempting to remove the residue to give the cleanest bonding surface possible.
I couldn't remember what the standard industrial solution was. All I could remember is that it's impossible to have 100% because water is introduced to the solution the moment it's exposed to air.
Check the documentation for your soldering station, if your soldering station doesn't have any documentation you can go with the melting point of the solder itself plus some overhead.
But as illustrated below, it can get a little complicated, if you're doing a lot of soldering with the same solder you'll experiment and figure out what's good for you
Ideally you want to use the lowest temperature you can get away with, using too much temperature can potentially shorten the lifespan of your soldering tips, and potentially damage the printed circuit board.
Get a testing board, any old board will do, and do some soldering and desoldering at different temperatures.
lets look at the melting points of common solders:
Tin/Lead (Sn63/Pb37) - 183°C
SAC 305 (Sn/Ag3.0/Cu0.5) - 220°C
SN100 (Sn) - 232°C
Now let's add the 50°C we need for making a good soldering connection:
Tin/Lead: 183°C + 50°C = 233°C
SAC 305: 220°C + 50°C = 270°C
SN100: 232°C + 50°C = 282°C
We now need to consider the type of soldering station we are using......Soldering Station which has very good performance, we should add approximately 100°C as the heat reserve for quick thermal recovery. The resulting temperature settings are:
Probably because it is a "dumb iron" with no thermal control. As soon as it touches anything it cools way down. Nowadays fortunately, cartridge tip irons are cheap if you're willing to buy from China. Cartridge tips have the heating element and temp probe built directly into the tip, heat up and adjust extremely fast to thermal loads.
As mentioned, you need the pad to be hot for the solder to wick onto it. There is missing info in step 1.
Step 1 should say to have a slightly wet iron (solder on the iron). You used this molten solder as the heat transfer medium. Hold the iron so the wet solder on it is touching the pad and lead. This gives more surface area for the heat to travel from the iron to the pad.
A dry iron touching a pad will have poor thermal connection, so the pad will take a long time to heat up.
I think an apt comparison is touching hot stuff with a wet glove. With a dry glove, the heat has to conduct through the fabric before heating your hand. With a wet glove, the heat is conducting through the water and burning your hand. The solder, like the water in the wet glove, is a bridge for the iron to transfer heat efficiently to the pad.
I think a lot of hobby soldering guides really neglect the idea of heat transfer and thermal mass.