China firm develops one-nanometer thick RISC-V chip with 2D materials

Wouldn't that have massive downsides? Chips are 3D structures not only out of necessity, but also because you need to route traces somewhere.

I guess that tech might be interesting if you can stack the chips, thought I can still see trouble with stacking "2D" sheets of paper as opposed to 3D structures where you reroute or cut off stuff in every layer