Intel @lemmy.zip BrikoX @lemmy.zip 3 wk. ago

Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

www.tomshardware.com Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

Smaller, faster, better.

1 crossposts

Hardware @lemmy.world Alphane Moon @lemmy.world 3 wk. ago

Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

www.tomshardware.com /pc-components/cpus/intel-looks-beyond-silicon-outlines-breakthroughs-in-atomically-thin-2d-transistors-chip-packaging-and-interconnects-at-iedm-2024